CPC heat sink (Cu, Cu-Mo, Cu composite material)
High heat dissipation that maximizes the performance of semiconductor devices! Stable mass supply is possible through rolling and punching processes.
We handle "CPC Heat Sinks (Cu, Cu-Mo, Cu Composites)." They have high thermal conductivity that maximizes the performance of semiconductor devices and can be supplied in large quantities stably through rolling and punching processes. These products can be applied to wireless communication in mobile phone base stations. 【Features】 ■ High thermal conductivity that maximizes the performance of semiconductor devices ■ Stable supply in large quantities through rolling and punching processes ■ A lineup of materials with various thermal conductivities and thermal expansion rates *For more details, please refer to the PDF document or feel free to contact us.
- 企業：アライドマテリアル 営業企画部
- 価格：Other
